wafers

Beyond lithography, a fab depends on etch, deposition, implantation, metrology, photoresist, wafers, and specialty gases. Each of these markets concentrated independently, and most show the same compounding-R&D pattern as lithography at smaller scale.

How a near-perfect silicon ingot becomes a billion-transistor chip. The 600-step fab cycle, photolithography down to 13.5 nm EUV (vaporized tin droplets at 220,000 °C), ion implantation for doping, the truth behind '5 nm' node naming, and the chokepoint-heavy global supply chain.